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    Electronicdesign Com Products Components Epoxy Mold Secures Sips On Laminates30259
    1. Technologies
    2. Components
    3. Interconnects

    Epoxy Mold Secures SIPs On Laminates

    Sept. 22, 2004
    For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and flip-chip array packages that have been under
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    Electronicdesign Com Products Components Epoxy Mold Secures Sips On Laminates30259
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    For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and flip-chip array packages that have been under filled. The compound is said to exhibit a flat nature that allows the entire package to be processed in a non-warped state. Other features include low warpage, the ability to under fill small ICs and passive components, and reliable adhesion to various laminate substrates. Furthermore, the epoxy is a non-antimony, non-bromine, and non-phosphorous molding compound capable of achieving JEDEC Level 2 requirements (depending on substrate) at a reflow temperature of 260°C. HENKEL LOCTITE CORP., Rocky Hill, CT. (716) 372-6300.

    Company: HENKEL LOCTITE CORP

    Product URL: Click here for more information

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