Able to withstand temperatures as low as 4°K, EP29LPSP is a two-component epoxy adhesive/sealant for cryogenic applications. The epoxy can resist cryogenic shock—that is, room temperature down to liquid helium temperatures in a five to 10 minute period. EP29LPSP’s low mixed viscosity of 400 cps makes it easy to apply. It has a tensile strength of 6500 psi and a tensile modulus of greater than 375,000 psi. When cured, EP29LPSP provides superior electrical insulation. With a dielectric constant of 3.6, the material has a Shore D hardness of 80. The epoxy can be cured at room temperature but best results are obtained if it is heat cured at 130°F to 165°F for six to eight hours. The optically clear EP29LPSP is available in pint, quart, gallon, and five-gallon kits, as well as in syringe applicators. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.
Company: MASTER BOND INC.
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