Hybrid Microcircuits Available With MIL-STD Packaging

Oct. 8, 2008
Hermetic packaging of industry-standard die and up screening of components makes a line of hybrid microcircuit capabilities suitable for military applications. The packaged die service includes assembling, sealing, and screening the packages to

Hermetic packaging of industry-standard die and up screening of components makes a line of hybrid microcircuit capabilities suitable for military applications. The packaged die service includes assembling, sealing, and screening the packages to MIL-STD-883 specifications, including leak, centrifuge, temperature cycle, burn-in, and electrical testing. The company also supports quality provisions such as traceability, visual inspection, and in-line QCI requirements. The company is on the DSCC Qualified Manufacturer List of hybrid electronics suppliers, and its products meet the requirements of MIL-PRF-38534, Class H. TT ELECTRONICS BI TECHNOLOGIES, Fullerton, CA. (714) 447-2345.

Company: TT ELECTRONICS BI TECHNOLOGIES

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!