Nickel Barrier Thermistors Offer Better Processing

These new surface-mount NTC thermistors with nickel barrier metalization are said to be easy to process, especially during reflow soldering. The three-layer termination includes an inner electrode, a silver base layer, a nickel diffusion barrier and a tin outer layer. For reflow soldering, the thermistors with the nickel barrier offer better wetability and solderability than conventional SMT types with AgPD (silver paladium) metalization. This is particularly true at low soldering temperatures. The new SMDs in case size 0402 are claimed to be the smallest NTC thermistors on the market. EPCOS INC., Iselin, NJ. (800) 888-7728.