BGA’s are the boon and bane of engineers and printed circuit board designers. Their unparalleled pin density and low lead inductance are essential in today’s high-pin count, high-frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. The quick overview provided here offers engineers a good starting point for improving BGA designs.
