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    FastSPICE Simulator Accelerates Throughput Tenfold

    Oct. 22, 2013
    The Spectre XPS (eXtensive Partitioning Simulator) FastSPICE simulator delivers faster and more comprehensive simulation for large, complex chip designs, according to developer Cadence. New partitioning technology speeds throughput by 10X, and allows higher capacity while requiring 2X to 3X less system memory.

    The Spectre XPS (eXtensive Partitioning Simulator) FastSPICE simulator delivers faster and more comprehensive simulation for large, complex chip designs, according to developer Cadence. New partitioning technology speeds throughput by 10X, and allows higher capacity while requiring 2X to 3X less system memory.

    Accurate timing measurement combined with the inclusion of IR-drop impact suits the simulator for advanced-node, low-power mobile designs. The FastSPICE technology unites with the existing Spectre environment, methodologies, and PDKs to facilitate adoption.

    CADENCE

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