Toshiba Corp. and Kaga Toshiba Electronics Corp. (Kaga Toshiba) plan to build a new semiconductor production fab based on 200mm wafers. The fab is expected to increase production capacity of power devices.
The investment in the building and production line is projected to be over 50 billion yen in the five years to 2010. Construction will commence in September 2006, with the start of mass production slated for the third quarter (July–September) of 2007. At full capacity, the fab will produce approximately 60,000 wafers a month.