Our annual Engineering University Bracket Challenge is now into round 3 (see figure). You have pared down the initial 32 U.S. engineering universities to these eight: Duke, Texas A&M, the University of Wisconsin, Georgia Tech, Stanford, the University of Illinois, the University of Michigan, and Purdue.
I’m glad to see that Ramblin’ Wrecks Georgia Tech is hanging in there, but I can’t vote for my alma mater. Now it is time for round three, so don’t forget to add your vote again and get the rest of your alumni to sound off as well.
We are down to eight in our annual single elimination tournament, and we need your input for round 3.
The selected university that makes it to the end will win an exclusive event on their campus with food, music, and prizes. One lucky university student will win the grand prize: an all-expense-paid, three-day trip to Maker Faire, May 17-20, 2018, in San Mateo, Calif.
Engineering University Bracket Challenge - 8 teams Left from Informa Engage on Vimeo.
In addition to bragging rights, one student from the top four universities will have a chance to win a Digi-Key InstaLab. Three random participants who vote and register in a single round will win a $50 Amazon gift card, while five random participants who vote and register for all the rounds will win a $100 Amazon gift card.
The competition is brought to you by Electronic Design and Machine Design, plus our sponsors Digi-Key, Microchip, and Renesas.
