3G 1394 Chip Needs A Third Less Power

Feb. 7, 2000
The TSB12LV26 is a third-generation IEEE-1394 open host controller interface (OHCI) link-layer device. Compared to the previous generation, this device has lower power consumption and improved price/performance. Using the company's most advanced...

The TSB12LV26 is a third-generation IEEE-1394 open host controller interface (OHCI) link-layer device. Compared to the previous generation, this device has lower power consumption and improved price/performance. Using the company's most advanced processes for 1394 and innovating with new features in link and physical layer (PHY) device design, the TSB12LV26 enables designers to scale the number of ports with flexible and adaptable solutions in the PC, consumer electronics, and peripherals markets.

The TSB12LV26 features deep FIFO memory with the company's dynamic threshold architecture, which assures high 1394 performance in PC and storage applications. The device seamlessly interfaces to all of the company's one-, two-, three-, four-, and six-port PHY devices. In addition, the TSB12LV26 not only conforms fully to the latest versions of all the pertinent specifications—including the IEEE 1394a 3.0, OHCI 1.0, and PCI 2.2 standards—but also to the PC98 and PC99 initiatives.

Portable and handheld applications that require extended battery life will benefit from the new device, since it consumes one-third the power of the previous generation and reduces costs by 30%. Also, a wider range of applications is now available to 1394 designers because of the broad range of package options, which include thin quad flat pack (TQFP), ball grid array (BGA), and MicroStar BGA.

Implementing 1394 has traditionally required two chips, and this is the case with the TSB12LV26. However, the company is getting ready to sample an integrated device—an OHCI Lynx and a 400-Mbit, two-port PHY on one chip.

The TSB12LV26 OHCI link layer interface device is available now in a 100-pin TQFP package. Its price is $7.94 each in 50,000-unit quantities.

Texas Instruments Inc., Semiconductor Group, SC-99081b, Literature Response Center, P.O. Box 172228, Denver, CO 80217; (800) 477-8924, ext. 4500; www.ti.com/sc/bus.

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!