Flash-Memory Family Delivers Densities From 16 to 256 Mbits

May 10, 2004
The complete Spansion S29AL/GLxxxM flash-memory family was developed, manufactured, and produced entirely by FASL LLC. All chips in the family are based on the MirrorBit memory-cell technology employed by Advanced Micro Devices in its flash-memory...

The complete Spansion S29AL/GLxxxM flash-memory family was developed, manufactured, and produced entirely by FASL LLC. All chips in the family are based on the MirrorBit memory-cell technology employed by Advanced Micro Devices in its flash-memory family (that is before the memory group joined the flash-memory group at Fujitsu to form Spansion, or FASL LLC). The S29AL/GLxxxM memory chips, produced using 230-nm design rules, come in capacities ranging from 16 to 256 Mbits. The family is optimized for embedded and industrial markets, and can deliver a cost structure comparable to 180-nm multilevel cell (MLC) and 130-nm single-bit/cell floating-gate technologies. The higher density members of the S29L/GLxxxM family will migrate to an advanced, 110-nm version of the MirrorBit technology by late 2004 for lower cost and still higher capacities.

FASL LLCwww.spansion.com/overviewwww.amd.com, www.fma.fujitsu.com

About the Author

Dave Bursky | Technologist

Dave Bursky, the founder of New Ideas in Communications, a publication website featuring the blog column Chipnastics – the Art and Science of Chip Design. He is also president of PRN Engineering, a technical writing and market consulting company. Prior to these organizations, he spent about a dozen years as a contributing editor to Chip Design magazine. Concurrent with Chip Design, he was also the technical editorial manager at Maxim Integrated Products, and prior to Maxim, Dave spent over 35 years working as an engineer for the U.S. Army Electronics Command and an editor with Electronic Design Magazine.

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