System-On-A-Chip Design With Platform ASICs

Jan. 13, 2005

Where does the platform ASIC position itself versus other ASIC solutions?

A platform ASIC fills the design gap between the full cell-based ASIC design, which typically requires about 25 masks and a 12- to 18-month design cycle, and the in-system instantly configurable and off-the-shelf field-programmable gate array. Platform ASICs and their cousins, the structured ASICs, often can provide a lower-cost solution than a cell-based design when component volumes are a few hundred thousand units or less. As an alternative to the high-complexity FPGAs, the platform ASIC also can offer significant cost reductions once a design is "locked in" and unit volumes approach 5000 or more. Nonrecurring engineering charges are significantly lower than they are for cell-based designs as well, since only a few metal-mask layers must be customized versus the 25 or so layers a cell-based ASIC requires.

What differentiates a platform ASIC from other approaches?

A platform ASIC consists of a partially predesigned chip that contains a predetermined collection of resources, such as several hundred thousand to several million logic gates, several hundred thousand to several million bits of SRAM storage, phase-locked loops, high-speed serial I/O ports, general-purpose I/O pads, and embedded CPUs. The platform ASIC supplier may have multiple predefined platforms ready and waiting for customers. All the customer needs to do is supply a synthesized netlist, and the vendor's tools will convert the netlist into the metal wiring layers needed to finalize the chip. In contrast, cell-based ASICs are designed to order from the first diffusion layer to the final metal layer. And, FPGAs are fully fabricated chips that accept a stream of data bits that configure the RAM-based, flash-memory-based, or antifuse-based logic cells (see the table).

Click here to download the PDF version of this entire article.

About the Author

Dave Bursky | Technologist

Dave Bursky, the founder of New Ideas in Communications, a publication website featuring the blog column Chipnastics – the Art and Science of Chip Design. He is also president of PRN Engineering, a technical writing and market consulting company. Prior to these organizations, he spent about a dozen years as a contributing editor to Chip Design magazine. Concurrent with Chip Design, he was also the technical editorial manager at Maxim Integrated Products, and prior to Maxim, Dave spent over 35 years working as an engineer for the U.S. Army Electronics Command and an editor with Electronic Design Magazine.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!