Flash & FCRAM Stacked In Super Small MCP

Sept. 1, 2000
The high-density, small-footprint, low-power memory required by many new portable electronic products is said to be satisfied by new devices that stack in a highly compact package flash memory and the company's Fast Cycle RAM (FCRAM). The Multi-Chip

The high-density, small-footprint, low-power memory required by many new portable electronic products is said to be satisfied by new devices that stack in a highly compact package flash memory and the company's Fast Cycle RAM (FCRAM). The Multi-Chip Packages (MCPs) use the company's FlexBank architecture to stack either 32 or 64 Mbits of dual-operation flash and 16 Mbits of FCRAM with an asynchronous SRAM interface.
The new MCPs also feature 2.3V to 2.7V operation, have a starting price of $75 each in sample quantities, and are expected to play key roles in bringing to market cell phones capable of downloading animation or graphics from the Internet and transferring data at rates of 384 Kb/s or more.
The company is also introducing nine new versions of a series of MCPs that link flash memory and SRAM together. The devices stack 16 Mbits of dual-operation flash and 2 or 4 Mbits of SRAM in a compact, 7.0 mm x 7.2 mm x 1.2 mm package that is half the size of previous versions.

Company: FUJITSU MICROELECTRONICS INC.

Product URL: Click here for more information

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!