Tiny, High-Capacity Flash Passes Three S's Test

Jan. 1, 2001
Simple, seamless and scalable are among the key features characterizing a new family of high-capacity miniature flash memory devices. Initially available in capacities of 16, 32 and 64 Mbytes and housed in thin, fine-pitch ball grid array (TFBGA)

Simple, seamless and scalable are among the key features characterizing a new family of high-capacity miniature flash memory devices. Initially available in capacities of 16, 32 and 64 Mbytes and housed in thin, fine-pitch ball grid array (TFBGA) packages measuring just 17 x 12 x 1.2 mm thick, TriFlash embedded flash memories employ the same simple three-I/O-pin serial interface established by SPI and MMC industry standards. This, coupled with TriFlash's built-in controller circuit for transparently managing memory operations, makes the new devices simple to design into µP or µC platforms.
TriFlash's architecture also allows the flash devices to be seamlessly integrated with removable memory cards, as well as supporting the scalability of storage capacities from the lowest to the highest using the same small footprint plastic package. TriFlash is expected to find wide use in storing audio, video and data for small portables, such as cell phones and MP3 players. Price: $35 for 16 MB, $60 for 32 MB and $110 for 64 MB each/1,000.

Company: SANDISK CORP.

Product URL: Click here for more information

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