Electronic Design
  • Resources
  • Directory
  • Webinars
  • CAD Models
  • Video
  • Blogs
  • More Publications
  • Advertise
    • Search
  • Top Stories
  • Tech Topics
  • Analog
  • Power
  • Embedded
  • Test
  • AI / ML
  • Automotive
  • Data Sheets
  • Topics
    - TechXchange Topics --- Markets --AutomotiveAutomation-- Technologies --AnalogPowerTest & MeasurementEmbedded
    Resources
    Electronic Design ResourcesTop Stories of the WeekNew ProductsKit Close-UpElectronic Design LibrarySearch Data SheetsCompany DirectoryBlogsContribute
    Members
    ContentBenefitsSubscribeDigital editions
    Advertise
    https://www.facebook.com/ElectronicDesign
    https://www.linkedin.com/groups/4210549/
    https://twitter.com/ElectronicDesgn
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    Electronicdesign 6074 63391promo
    1. Technologies
    2. Embedded
    3. Digital ICs
    4. Memory

    Hybrid Memory Cube Shows New Direction For High Performance Storage

    April 12, 2013
    The new Hyper Memory Cube standard looks to bring higher performance, higher capacity storage to servers and high end systems using 3D stacking and through silicon via's. It is designed to improved DRAM performance by a factor of 15.
    William G. Wong
    Insidepenton Com Electronic Design Adobe Pdf Logo Tiny
    Download this article in .PDF format
    This file type includes high resolution graphics and schematics.

    The final spec for the Hybrid Memory Cube (HMC) is done. Designed to improved DRAM performance by a factor of 15, the Hybrid Memory Cube Consortium (HMCC) standard specifies a high-speed, low-overhead memory protocol that targets the next generation of local storage for servers and networking devices. The architecture can employ 3D multilayer chips built using through silicon vias (TSV).

    Related Articles

    • Magnetic DRAM Arrives
    • Non-Volatile DIMMs and NVMe Spice Up The Flash Memory Summit
    • Understanding The Ivy Bridge Architecture
    • Memory And Processor Advances Redefine Digital Technology

    Memory layers typically are stacked on a logic layer that implements the HMC protocol. The first version of the standard supports up to eight memory layers with a maximum address space of 8 Gbytes. It also supports multiple cubes within a system to expand the amount of memory as well as the bandwidth available to the system (Fig. 1). These cubes are designed to replace the ubiquitous dual-inline memory module (DIMM) found in systems now.

    The HMC specification defines two physical-layer (PHY) configurations: short reach and ultra-short reach. The short-reach configuration addresses runs up to 8 in. It consumes 6 jJ/bit and runs at 10 Gbits/s or 12.5 Gbit/s. The ultra-short-reach configuration is designed for runs under 3 in. It is energy optimized so it consumes only 1 to 2 pJ/bit. It runs at 10 Gbits/s. Both use a common packet protocol.

    The cube includes 16 pairs of links. There are four channels with four links/channel. Each channel has a 40-Gbyte/s bandwidth or 160 Gbytes/s/cube. The packet protocol allows messages to be forwarded through adjacent cubes. This increases latency, though developers are already utilizing non-uniform memory access (NUMA) architectures with multichip, multicore configurations. Multilevel NUMA is more challenging from a software standpoint, but it offers significant advantages. The packet protocol also provides limited atomic operation support.

    Electronicdesign Com Sites Electronicdesign com Files Uploads 2013 04 63391 Fig1sm Hybrid Memory Cube
    Figure 1. Hyper Memory Cube (HMC) storage uses high speed serial links. Modules can be linked together to provide more storage and bandwidth.

    Stacking significantly reduces the footprint for memory. Switching to high-speed serial links reduces the number of connections and, along with linked cubes, greatly simplifies board layout. In theory, it would be possible to create a switch node without storage. Likewise, non-volatile memory could be added to the mix. For now, DRAM is where it’s at. HMCC has the support of the major players in storage and computing including Micron, Samsung, and Hynix.

    The standard will have a major impact on adoption and interoperability. Initially single HMC designs will dominate but multicube solutions will be in high demand. Of all the emerging memory technologies, HMC is the one that will likely have the most impact in the long run.

    Insidepenton Com Electronic Design Adobe Pdf Logo Tiny
    Download this article in .PDF format
    This file type includes high resolution graphics and schematics.

    Continue Reading

    Quick Poll: A Memory Quiz

    7 Technologies that Will Change Everything

    Sponsored Recommendations

    Designing automotive-grade camera-based mirror systems

    Dec. 2, 2023

    Design security cameras and other low-power smart cameras with AI vision processors

    Dec. 2, 2023

    Automotive 1 TOPS vision SoC with RGB-IR ISP for 1-2 cameras, driver monitoring, dashcams

    Dec. 2, 2023

    AM62A starter kit for edge AI, vision, analytics and general purpose processors

    Dec. 2, 2023

    Comments

    To join the conversation, and become an exclusive member of Electronic Design, create an account today!

    I already have an account

    New

    Can Silicon Supply Enough Power for the Future of AI Silicon?

    Innovators in Electronic Design - Women in Science & Engineering: Maria Anhalt, CEO, Elektrobit

    DynaNIC Software Eases SmartNIC Development

    Most Read

    Observability Framework Exposes DDS

    Virtual Circuits Beat Out Quantum Computer

    Master Cell Balancing to Enhance EV Performance


    Sponsored

    Four-channel synchronous vibration sensor interface reference design

    3.3V 1A, Low EMI, 92% Efficiency DC/DC Module in Single Layer TO-247 Form Factor Reference Design

    16S-17S Battery pack reference design with low current consumption

    Electronic Design
    https://www.facebook.com/ElectronicDesign
    https://www.linkedin.com/groups/4210549/
    https://twitter.com/ElectronicDesgn
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    • About Us
    • Contact Us
    • Advertise
    • Do Not Sell or Share
    • Privacy & Cookie Policy
    • Terms of Service
    © 2023 Endeavor Business Media, LLC. All rights reserved.
    Endeavor Business Media Logo