Test Socket Handles Many Package Types

Oct. 6, 2005
Test and burn-in of integrated circuits can be performed by a new socket that accommodates packages from 41 mm2 to 55 mm2. This covers ICs such as SRAMs, DRAMs, DSPs and flash memories. Packages that can be tested are CSP,

Test and burn-in of integrated circuits can be performed by a new socket that accommodates packages from 41 mm2 to 55 mm2. This covers ICs such as SRAMs, DRAMs, DSPs and flash memories. Packages that can be tested are CSP, MicroBGA, LCC, LGA, QFP, QFN and MLF. Lead pitches from 0.45 mm to 2.54 mm can be accommodated. The socket can test at frequencies up to 1 GHz. A spring-loaded, cam actuated pressure pad applies force against the device after the socket lid is closed and latched and the cam is in position. Reversing the cam removes the force prior to unlatching the spring-loaded lid. The signal path of the socket during test is 1.92 mm. For pitches above 0.8 mm, it is possible to achieve 1 dB of bandwidth at 1 GHz using a large probe. The temperature range is -55° to +150°C. Estimated contact life is 500,000 cycles. Pricing for a 50-lead socket starts at $68.25 each/10. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.

Company: ARIES ELECTRONICS INC.

Product URL: Click here for more information

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