SiP Integrates Driver Plus Two Power MOSFETs

Oct. 8, 2008
Predicting the highest efficiency and smallest footprint available, the R2J20601NP system in package (SiP) packs a three-quarter driver IC and two power MOSFETs with high-side and low-side functions in a 56-pin QFN package measuring 8 mm x 8 mm x 0.8

Predicting the highest efficiency and smallest footprint available, the R2J20601NP system in package (SiP) packs a three-quarter driver IC and two power MOSFETs with high-side and low-side functions in a 56-pin QFN package measuring 8 mm x 8 mm x 0.8 mm. The device specifies a maximum efficiency of 87% when operating at 1 MHz with a 12V input and 1.3V output. Typical applications include CPU voltage regulators for PCs and servers, dc/dc converters that manage high-current DSPs and ASICs, and dc/dc converters in communications equipment. Sample price is $6 each. For more details, call Akiko Ishiyama at RENESAS TECHNOLOGY AMERICA INC., San Jose, CA. (408) 382-7407.

Company: RENESAS TECHNOLOGY AMERICA INC.

Product URL: Click here for more information

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