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    1. Technologies
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    3. Boards

    Adhesives Fill Gaps For High-Speed Dispensing

    Feb. 1, 1999
    Both the AMICON E 6750 and 6752 SMT adhesives have the gap-filling and adhesion properties to enable manufacturers to increase the speed of their production lines. The adhesives feature high dot profiles, which fill gaps between the board and

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    Both the AMICON E 6750 and 6752 SMT adhesives have the gap-filling and adhesion properties to enable manufacturers to increase the speed of their production lines. The adhesives feature high dot profiles, which fill gaps between the board and components, and high adhesion, which ensures components will not fall off during board processing.

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