EMI Shielding Is A Snap

Jan. 1, 2003
> A new board-level, multi-cavity shielding product has recently come to market with promises of excellent protection against electromagnetic interference. Referred to as snapSHOT, this metallized, thermoformed EMI plastic shield is easy to install...

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A new board-level, multi-cavity shielding product has recently come to market with promises of excellent protection against electromagnetic interference. Referred to as snapSHOT, this metallized, thermoformed EMI plastic shield is easy to install and remove. It also can accommodate intricately shaped designs. The fact that it provides electrical insulation on the inside allows for significant thickness reduction over currently available shielding solutions.

SnapSHOT is manufactured from a high-temperature, high-performance plastic material that is extremely lightweight. It comes packaged in bulk, trays, or a tape and reel. This packaging makes the shield easy to install using manual, semi-automated, or fully automated equipment.

For example, the snapSHOT EMI shield can be attached to a printed-circuit board (PCB) using a patented snap-attachment mechanism. During this installation, BGA spheres are adhered to the PCB panel using a standard stencil printer that is equipped with a special head. The spheres provide the electrical connection to the ground plane, as well as the mechanical means for retention of the shield. Once the PCB has been populated and the spheres are permanently attached, the shield is simply snapped into place. The installation of the shield onto the BGA spheres is not permanent. As a result, it may be easily removed by hand without special tooling. Contact the company directly for pricing information.

W.L. Gore & Associates, Inc.402 Vieve's Way, Elkton, MD 21922; (302) 292-5100, www.gore.com/electronics.

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