Kit Offers Lead-Free Way Of Removing Chips From Boards

Sept. 1, 2002
Designed to make removal of QFPs, PLCCs, SOICs and other SMT devices from pc boards quick, simple and safe, the Chip Quik Lead-Free SMD Removal Kit consists of 2.5' of lead-free removal alloy, 1 cc of no-clean tack flux, and 4 alcohol pads. To remove

Designed to make removal of QFPs, PLCCs, SOICs and other SMT devices from pc boards quick, simple and safe, the Chip Quik Lead-Free SMD Removal Kit consists of 2.5' of lead-free removal alloy, 1 cc of no-clean tack flux, and 4 alcohol pads. To remove an SMT device, the kit’s rework flux is applied to all of the surface-mount device’s pins and then a low temperature soldering iron is used to melt the lead-free removal alloy onto the device’s solder joints. The alloy reacts with the solder to form a molten state, allowing the device to be easily removed using a vacuum pen. The removal operation is conducted at low temperatures (under 300°F). And In addition to eliminating the need for removal equipment, the Chip Quik kits are said to prevent damage to devices and to involve materials that are easy to clean-up. The kits cost $19 each, with the removal alloy also available in 4', 16' and 32' lengths. For more details, contact Mark Wilson at EMULATION TECHNOLOGY INC., Santa Clara, CA. (408) 982-0660, ext 241.

Company: EMULATION TECHNOLOGY, INC.

Product URL: Click here for more information

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