New self-soldering headers come with 2.0 mm and 0.100” lead spacing. By embedding individual solder and flux segments into the header housing, these headers self solder with single-pass reflow, using industry standard SMT processes without adding any additional solder, solder paste or flux. The headers come in vertical, right-angle and board stacking versions. They are designed to make IPC class III solder joints in pc boards up to 0.125” thick and eliminate hand and wave soldering and press fitting. TEKA INTERCONNECTION SYSTEMS, Warwick, RI. (401) 785-4110.
Company: TEKA INTERCONNECTION SYSTEMS
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