Land-Grid Array Sockets Aid Testing, Characterization

Sept. 1, 1998
Providing virtually invisible interconnection between the device lands and DUT board pads for manual device characterization and automated production testing, Land-Grid Array (LGA) test sockets offer firm's Fuzz Button contact pins that are made from

Providing virtually invisible interconnection between the device lands and DUT board pads for manual device characterization and automated production testing, Land-Grid Array (LGA) test sockets offer firm's Fuzz Button contact pins that are made from a single length of gold-plated wire that is compressed into cylindrical shape to produce contact elements with excellent electrical characteristics. The distortion signal paths support high repeatability in all test modes.

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!