EMI Gaskets Promise Reduced Emissions

Designed to fit over IEEE-1394, right-angle upright connectors, a new line of EMI gaskets provides a low-impedance path from the connector shell to the faceplate for superior grounding and reduced emissions. Made of beryllium, the gaskets are mounted over the connectors and soldered to the pc-board, making contact with the con- nector shell and faceplate when the board is assembled into its housing. The devices are available in trays for pick-and-place assembly, and simple through-pin mounting accomodates automated wave soldering.