Interconnections & Packaging: Central-Office Shelf Expands AdvancedTCA Functionality

March 1, 2004

The CO-Star 19-in. shelf with 14 slots (in dual, dual-dual star, and full-mesh versions) enhances the functionality of the PICMG 3.0 AdvancedTCA standard. It meets GR-63, GR-1089, UL/EN, 60950, and EN55024 for NEBS Level III specifications. Designed for 5-Gbit/s rates, the shelf features five-nines reliability, 200-W/board cooling at 55°C, field-replaceable fan trays and power entry, and two Force Computers Shelf-Management controllers. Power is distributed using redundant A and B feed systems for a total of four feeds for the dual A and B supplies. Typical working voltage is 40.5 to 62 V, and working current per slot is 5.1 A. The shelf goes for $10,730. Availability is within eight to 10 weeks.

Tracewell Systemswww.tracewellsystems.com; (800) 848-4525

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.