JEDEC 51 Testing Ensures Consistent Thermal Evaluation

June 2, 2005
The company's JEDEC 51 testing services claim to provide consistent thermal measurements for determining component attributes and controlling junction temperatures in semiconductor devices. The tests are used by component, board, and system

The company's JEDEC 51 testing services claim to provide consistent thermal measurements for determining component attributes and controlling junction temperatures in semiconductor devices. The tests are used by component, board, and system manufacturers for comparing the performances of different packages containing similar devices or similar packages with different devices. Testing covers all 11 current JEDEC 51 standards, which includes different environmental and test board conditions for common package types such as wire bond chips, leaded surface-mount components, and perimeter and area array through-hole leaded packages. Test equipment includes laboratory wind tunnels, wind tunnel controllers, thermocouples, and automatic temperature and velocity scanners. A full testing schedule typically takes one to two weeks. ADVANCED THERMAL SOLUTIONS INC., Norwood, MA. (781) 769-2800.

Company: ADVANCED THERMAL SOLUTIONS INC.

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