Copper Flex Interposer Enlists PCBeam Technology

The company, in partnership with Neoconix, unveils a flexible-copper, high-density high-speed interposer in a tool-less configuration. The FlexBeam tool-less copper flex interposer provides densities of 1 mm or less in a variety of pin-matrix configurations and integrates with Neoconix’s HD&S PCBeam interposer that provides a high-density and high-speed interface for flex-to-PCBA applications. The integrated copper flex assembly with PCBeam interposer allows differential signal speeds in excess of 10 Gb/s and single-ended speeds of 4 GHz and higher with a crosstalk of less than 3% in a pin-matrix configuration. Moreover, the assembly provides the contact configuration to allow for board-to-flex pin counts of 500 input/outputs or greater. MOLEX INC., Lisle, IL. (800) 786-6539.