Newcomers Join Low-Profile Interface Line

June 1, 2001

The Low Profile Interface line of connectors has been expanded to include the FSI and SEI series of one-piece interfaces and the MSB and CSB series of high-density interfaces. The one-piece components are available on a 1-mm pitch with up to 100 contacts. Also, the FSI series has a mated board spacing of 3 mm and the SEI series offers up to 30 contacts for a mated board spacing of 1.65 mm.
The high-density interfaces provide up to 500 I/O lines on a 1.27-mm pitch with profiles as low as 3 mm between mated boards. Tiger Eye Beryllium Copper contacts are used for reliability. Other features, including solder-ball attachment, are also available.


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