Test/Burn-In socket Takes On 13-mm² Devices Up To 1 GHz

Sept. 1, 2003

Able to accommodate any device package up to 13 mm2, a new test/burn-in socket targets devices with a 0.5-mm pitch or larger used in applications up to 1 GHz. It's ideal for test-and-burn and burn-in applications of chip-scale-package,...

Roger Allan

Able to accommodate any device package up to 13 mm², a new test/burn-in socket targets devices with a 0.5-mm pitch or larger used in applications up to 1 GHz. It's ideal for test-and-burn and burn-in applications of chip-scale-package, MicroBGA, DSP, land-grid-array, DRAM, and flash devices.

Two molded plastic alignment pins accurately locate incorporated solder-less pressure-mount compression spring probes. Spring probe contacts are 9 to 12 g per contact for 0.50-mm to 0.75-mm pitches and 17 to 20 g per contact for 0.80-mm and larger pitches. The probes are made of a heat-treated beryllium copper alloy, plated with 30 µin. minimum of gold per MIL-G-45204 over 30 µin. minimum of nickel per QQ-N-290.

The socket handles up to 500,000 cycles. Operating temperature ranges from −55°C to 150°C. Molded components are UL94V-0 Ultem, and machined components are UL94V-0 PEEK. Four stainless-steel screws make it easy to mount and remove the socket from the burn-in board.

Price for a 100-lead socket starts at $175 in single-piece quantities.

Aries Electronics Inc.www.arieselec.com

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.