Test/Burn-In socket Takes On 13-mm² Devices Up To 1 GHz

Sept. 1, 2003
Able to accommodate any device package up to 13 mm2, a new test/burn-in socket targets devices with a 0.5-mm pitch or larger used in applications up to 1 GHz. It's ideal for test-and-burn and burn-in applications of chip-scale-package,...

Able to accommodate any device package up to 13 mm2, a new test/burn-in socket targets devices with a 0.5-mm pitch or larger used in applications up to 1 GHz. It's ideal for test-and-burn and burn-in applications of chip-scale-package, MicroBGA, DSP, land-grid-array, DRAM, and flash devices.

Two molded plastic alignment pins accurately locate incorporated solder-less pressure-mount compression spring probes. Spring probe contacts are 9 to 12 g per contact for 0.50-mm to 0.75-mm pitches and 17 to 20 g per contact for 0.80-mm and larger pitches. The probes are made of a heat-treated beryllium copper alloy, plated with 30 µin. minimum of gold per MIL-G-45204 over 30 µin. minimum of nickel per QQ-N-290.

The socket handles up to 500,000 cycles. Operating temperature ranges from −55°C to 150°C. Molded components are UL94V-0 Ultem, and machined components are UL94V-0 PEEK. Four stainless-steel screws make it easy to mount and remove the socket from the burn-in board.

Price for a 100-lead socket starts at $175 in single-piece quantities.

Aries Electronics Inc.www.arieselec.com

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