Overmolding Process Protects Components

A plastics overmolding process is available with which to fully encapsulate delicate pc boards, lead frames, sensors, magnets, and other sensitive electronic components. The Matrix process uses high temperature-resistant resins such as PBT and high-flow nylons. Featuring close-tolerance overmolding, the proprietary encapsulation process is said to eliminate time-consuming potting and curing steps, as well as other secondary operations. The process is capable of producing components ranging in size from 0.090” x 0.090” x 0.200” to 9” x 9” x 1” with tolerances of 0.0002”, depending on part size and construction. Price depends on design requirements, material and quantity.