Packaging & Interconnects: More Card Guides Equals Easier Use Of Subracks

Sept. 20, 2004

Schroff has expanded its range of card guides for use with both sheet metal and the company's EuroPRO 19-in. subrack family. The cards feature UL94-V0 flammability, a tapered entrance to ease board installation, and positive-retention installation clips for card-guide removal and installation. Also included are 160- and 220-mm single-board computer guides and 80-mm rear transition board guides. They come in red and gray colors and fully comply with the IEEE 1101.10 and 1101.11 standards. Also available are green card guides with a 0.1-in. offset for power-supply applications. Price is $0.52 per unit, and delivery is from stock.

Schroff Ltd.www.schroff.us(888) 550-9543

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.