Packaging/Interconnects: Matched-Impedance Connector Module Targets 0.5 To 3.2 Gbits/s

Nov. 10, 2003

The FCN-261Z00x matched-impedance loop-back connector module is designed for testing systems operating at 500 Mbits/s to 3.2 Gbits/s per channel. Representing an expansion of the high-speed microGiGaCNTM differential connector series, it uses an internal matched-impedance pc board to perform signal testing. Crosstalk is under 4%, and in-pair skew is under 5 ps. It fits the current form factor of the InfiniBand/IEEE 802.3ak CX4 4x and 12x backshells and measures 48.9 by 71.9 mm (which includes the latching mechanism). Thumbscrew versions will be available in the third quarter for Serial Attached SCSI and Serial ATA-2 configurations. Available from stock, a 12x loopback unit costs $38.75 and a 4x unit costs $31.26, both in lots of 50 to 100.

Fujitsu Components America Inc.www.fcai.fujitsu.com; (800) 380-0059

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.