Packaging & Materials: BGA Sockets/Adapters Come In Three Grid Sizes

Aug. 23, 2004

Socketing BGA devices and interconnecting circuit boards now can be more flexible thanks to a trio of BGA socket/adapter systems. The system's three grid sizes fit 0.8- to 1.00-mm and 0.50-mm grid footprints. Press-fit into every mating socket is a gold-plated beryllium-copper "three-finger" contact. The company's #04 contact with a 0.010-in. diameter mating pin is used for 1.00-mm grids and #05 contact with a 0.018-in. diameter pin for 0.05-in. grids. A tapered EZ-IN pin is also available for 0.05-in. grids. In 100-unit lots, the S582-11-025-03-005414 socket and the S540-10-025-03-005498 adapter are priced at $12.508 and $12.245 each, respectively, with a four-week lead time.

Mill-Max Mfg. Corp.www.mill-max.com (516) 922-6000, ext. 211

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.