Virtex-5-Based ASIC Prototyping System Has Total Recall

April 9, 2007
Based on Xilinx’s Virtex-5 LX330 FPGAs, which are the largest FPGAs available today, the HAPS-50 series ASIC prototyping boards from Hardi Electronics can be stacked or interconnected to handle ASIC designs of virtually any size. The first member in the H

Based on Xilinx’s Virtex-5 LX330 FPGAs, which are the largest FPGAs available today, the HAPS-50 series ASIC prototyping boards from Hardi Electronics can be stacked or interconnected to handle ASIC designs of virtually any size. The first member in the HAPS-50 family, the HAPS-52, has a capacity of 4 million ASIC gates. More boards in the series will be available within two months.

The HAPS-52 board sports more I/O and inter-FPGA connections than previous generations of the HAPS system. It also offers a global bus, more I/O-voltage regions, and a more flexible clocking scheme. In addition, new functions provide improved monitoring and self-test, as well as remote configuration and setup of the board. Everything possible is made to reduce the time it takes to get the ASIC design running on this FPGA board.

In addition to the hardware improvements in the HAPS-50 series, Hardi has partnered with Synplicity to create a complete verification system. The combination of the HAPS-50 hardware and Synplicity’s Certify software with Total Recall debug technology makes for not only a powerful ASIC verification environment, but also a complete design flow that includes partitioning, synthesis, place and route, and debug.

The HAPS-50 series of motherboards is fully compatible with all previous generations, including the HAPS-10, HAPS-20, and HAPS-30 families. In addition, it meets the HapsTrak standard, which guarantees that all Hardi standard daughterboards and all custom-built boards will fit on the new system.

The HAPS-52 board will be available for delivery to customers in April for $47,000.

Hardi Electronics

www.hardi.com/haps/haps-52.htm

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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