PC-Board Design Package Supports Lead-Free Initiatives

Oct. 28, 2005
More designers are hewing to the new Restrictions on Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives mandating lead-free design. Now along comes a pc-board-design package to support their efforts. Among other en

More designers are adhering to the new Restrictions on Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives mandating lead-free design. Now along comes a pc-board-design package to support their efforts. Among other enhancements, version 8 of Zuken's Cadstar package supports lead-free soldering as well as lead-free component selection.

Various usability enhancements are included, such as the ability to rotate pin names and numbers within schematic symbols. Pin labels also can be assigned in the component libraries. Users can justify multiline text, and text can be aligned and rotated.

There's support for making electrical connections with jumpers, which can be added on the fly (as with vias). Also supported are rounded-rectangle pads, which improves lead-free soldering processes.

Thanks to the addition of a new technology called "trunking," auto-interactive routing is more efficient. Trunks address issues associated with handling different routes, buses, or differential pairs collectively as one entity. As a result, users can quickly sketch routes and manipulate collections of signal lines as a group. All interconnects at the end of a trunked group of signal lines are handled concurrently.

Signal-integrity concerns are made simpler in Cadstar 8.0. An accurate finite element method (FEM) field solver analyzes frequency-dependent losses and proximity effects on strong couplings. Eye-diagram generation is available for eye-mask verification and for analyses based on multibit sequence stimuli.

Available in mid-November, Cadstar 8.0 module prices start at $1000 each.

Zuken USA
www.cadstarworld.com/cadstar8

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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