Logic Package Measures Just 1.45 mm x 1 mm

Said to be the industry's smallest logic package, the NC7SZ125L three-state buffer and NC7SZ04L and NC7S04L inverters are the first devices to be released using MicroPak packaging technology. These devices are designed with a footprint of just 1.45 mm x 1 mm and a height of 0.55 mm, 65% smaller than SC70 packages. MicroPak achieves space savings via flat-bottomed packages and lead-free lands, as opposed to the second level interconnect to the circuit board. Prices start at $0.10 each/50,000. FAIRCHILD SEMICONDUCTOR CORP., South Portland, ME. (207) 775-8707.