Electronicdesign Com Products Components Test Socket Handles Small High Speed Chips32511

Test Socket Handles Small, High-Speed Chips

Oct. 8, 2008
An RF test socket for devices from 28 mm2 to 40 mm2 can be used for manual testing with lead pitches down to 0.50 mm. It handles devices with speeds from 1- to over 18-GHz such as MicroBGA, CSP, SRAM and DRAM, and Flash memories.

An RF test socket for devices from 28 mm2 to 40 mm2 can be used for manual testing with lead pitches down to 0.50 mm. It handles devices with speeds from 1- to over 18-GHz such as MicroBGA, CSP, SRAM and DRAM, and Flash memories. The socket measures 3.507” x 2.750” with signal paths of 0.077”. Solderless, pressure-mount compression springs allow the socket to be easily mounted and removed from a test board. The gold-over-nickel compression spring probe-screws leave very small witness marks on the bottom of the device’s solder balls, and are accurately located by two plastic alignment pins secured with four stainless steel screws. Contact forces are 9g to 12g per contact for 0.50 mm to 0.75 mm pitches and 17g to 20g per contact for 0.80 mm and higher pitches. Estimated contact life is over 500,000 cycles. Operating temperature range is -55º to +150º C. Pricing for a 100-lead socket starts at $599. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.

Company: ARIES ELECTRONICS INC.

Product URL: Click here for more information

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