Interconnections & Packaging: Board-Stacking Interconnect System Transmits Data Over 6.25 Gbits/s

March 1, 2004
Thanks to controlled-impedance pc boards with embedded ground planes, the HSC8 series of RISE-UP interconnects enables data transmission in excess of 6.25 Gbits/s and up to 3.5 GHz/differential pair in board-stacking applications. Connector interfaces...

Thanks to controlled-impedance pc boards with embedded ground planes, the HSC8 series of RISE-UP interconnects enables data transmission in excess of 6.25 Gbits/s and up to 3.5 GHz/differential pair in board-stacking applications. Connector interfaces (HSEC8/MEC8) permit traditional parallel board, perpendicular daughtercard, and horizontal or coplanar "pizza box" stacking. They're available with single-ended (50 or 70 I/Os) and differential-pair (33 or 46 I/Os) routing, and they provide a 25-mm (0.984 in.) stacking height. Available from stock, they start at $0.15 per mated line for a connector/pc-board system.

Samtecwww.samtec.com; (800) SAMTEC-9

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!