Interconnections & Packaging: Board-Stacking Interconnect System Transmits Data Over 6.25 Gbits/s

March 1, 2004

Thanks to controlled-impedance pc boards with embedded ground planes, the HSC8 series of RISE-UP interconnects enables data transmission in excess of 6.25 Gbits/s and up to 3.5 GHz/differential pair in board-stacking applications. Connector interfaces (HSEC8/MEC8) permit traditional parallel board, perpendicular daughtercard, and horizontal or coplanar "pizza box" stacking. They're available with single-ended (50 or 70 I/Os) and differential-pair (33 or 46 I/Os) routing, and they provide a 25-mm (0.984 in.) stacking height. Available from stock, they start at $0.15 per mated line for a connector/pc-board system.

Samtecwww.samtec.com; (800) SAMTEC-9

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.