Packaging/Interconnects: Sloped Enclosures Designed For Compact Desktop And Mobile Uses

April 12, 2004
The TekBox-Slope enclosures, molded in off-white or black ABS (UL94HB), have compact external dimensions of 6.30 by 3.70 by 1.44 in. The wide format fits desktop or mobile electronics with wide LCDs and keypad configurations. The sloping top molding...

The TekBox-Slope enclosures, molded in off-white or black ABS (UL94HB), have compact external dimensions of 6.30 by 3.70 by 1.44 in. The wide format fits desktop or mobile electronics with wide LCDs and keypad configurations. The sloping top molding is recessed for secure location of a membrane keypad or a polycarbonate product label. The rear panel can easily be machined for power and data cables. PC-board mounting pillars are provided in the top and base. Assembly is by four self-tapping screws. Special colors can be molded on demand. Nonslip rubber feet are available separately. Volume pricing starts at $10 each.

Teko Productswww.tekoenclosures.com (800) 965-9872

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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