Interconnect Technology Adjusts For Coplanarity Variances

Solderball Pin, a surface-mount interconnect technology, can be discretely placed to automatically adjust for coplanarity variances as high as 0.015 to 0.020 in. This method serves to create interconnections between parallel stacked pc boards, such as those used in power-device modules and/or daughterboard to motherboard assemblies. Designed with a high-conductivity copper peg on one end and a solderball on the other, Solderball Pins can be efficiently inserted into the daughter-card pc board. The pc board can then be placed on the motherboard pc board and reflow-soldered. A tapered peg design ensures easy insertion. Solderball Pins are packaged in tape-and-reel format and are available in pin diameters from 0.040 to 0.062 in., the same sizes that are being used in today's through-hole designs. For production quantities, prices range from $0.045 to $0.06 per piece.

Autosplice Inc.
www.autosplice.com; (858) 535-0077