Micro-Pitch Connectors Maximize Interconnect Density

Sept. 2, 2002
A line of micro pin-and-socket connectors on 0.8- and 1-mm pitch significantly increases interconnect density for small-form-factor, miniature applications while retaining the electrical and mechanical benefits of traditional pin-and-socket...

A line of micro pin-and-socket connectors on 0.8- and 1-mm pitch significantly increases interconnect density for small-form-factor, miniature applications while retaining the electrical and mechanical benefits of traditional pin-and-socket construction. The 0.8-mm system includes headers (FTE series) and stackers (AW series) that provide board spacings from 5 to 9 mm when mated with CLE series surface-mount sockets. The dual-row interconnects have up to 90 pins/row for pin-out densities as high as 350/in.2 of board space. The 1-mm pitch system also includes headers (FTM series) and stackers (MW series) with board spacings from 3.5 to 9.25 mm when mated with CLM or MLE series sockets. Both systems include right-angle headers for perpendicular board interface applications. Pricing begins at $0.08 to $0.10 per mated line.

Samtec Inc. www.samtec.com; (800) SAMTEC-9

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