Side-Stackable BGA Socket Boosts Packaging Densities

Aug. 4, 2003
The Pin-Ball socket can be soldered side by side directly to the existing footprint of a pc board, greatly improving packaging densities. According to its manufacturer, it is the first side-stackable BGA socket on the market. The surface-mount BGA and...

The Pin-Ball socket can be soldered side by side directly to the existing footprint of a pc board, greatly improving packaging densities. According to its manufacturer, it is the first side-stackable BGA socket on the market. The surface-mount BGA and LGA socket has 2-mm clearance for end components and can be used for 1.00- and 1.27-mm pitch packages up to 50 mm in any footprint and on any board. Designers can choose between a metal cover or a customized aluminized heatsink. The socket comes in a two-bolt (15-mm package or smaller) or a four-bolt (16- to 50-mm package) hold-down style. Pricing starts at $1.00 per ball in lots of five units.

Aries Electronics Inc.www.arieselec.com; (908) 996-6841

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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