Side-Stackable BGA Socket Boosts Packaging Densities

The Pin-Ball socket can be soldered side by side directly to the existing footprint of a pc board, greatly improving packaging densities. According to its manufacturer, it is the first side-stackable BGA socket on the market. The surface-mount BGA and LGA socket has 2-mm clearance for end components and can be used for 1.00- and 1.27-mm pitch packages up to 50 mm in any footprint and on any board. Designers can choose between a metal cover or a customized aluminized heatsink. The socket comes in a two-bolt (15-mm package or smaller) or a four-bolt (16- to 50-mm package) hold-down style. Pricing starts at $1.00 per ball in lots of five units.