Interconnections & Packaging: SMA PC-Board Connectors Fit Standard Surface-Mount Process

Feb. 2, 2004

Each model in a new line of SMA surface-mount connectors can be directly soldered to a pc board using a conventional reflow surface-mount process. Available in a flange size of 6.35 mm², they feature brass/steel bodies with gold or nickel platings. They also offer Teflon insulation and beryllium-copper pins. The connectors, rated for 18-GHz operation, come in standard packing of tubes or bulk packets. Applications include telecommunications, wireless networking products, instrumentation, point-of-sale (POS) equipment, security equipment, satellite receivers, and ground-positioning satellite (GPS) systems. Pricing is $1.99 each in 1000-piece quantities.

Electronika International Inc.www.electronicainc.com; (440) 743-7034

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.