Packaging & Interconnects: High-Density Power Interconnects Aimed At Elevated Board Stacking

May 24, 2004
The TPCM/TPCF series high-density power interconnects on 2-mm (0.0787-in.) pitches will find their way into elevated board stacking. These four-row interconnects can carry 27 A at 80°C over four banks of four power pins each. An eight-bank...

The TPCM/TPCF series high-density power interconnects on 2-mm (0.0787-in.) pitches will find their way into elevated board stacking. These four-row interconnects can carry 27 A at 80°C over four banks of four power pins each. An eight-bank system is being tested. Banks are separated from the nearest signal pins by 3.5 mm to maximize power capacity. Board spacing can range from 10 mm (0.394 in.) to 20 mm (0.787 in.). End shrouds ensure proper mating in blind applications. Tiger Buy tuning-fork-style phosphor-bronze contacts provide high levels of retention and cost-effectiveness. Pricing for the TPCM/TPCF series begins at $0.06 to $0.08 per mated line.

Samtec Inc.
www.samtec.com
(800) SAMTEC-9

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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