Packaging & Interconnects: SOIC Adapters Bring Cost-Effective Upgrades To Older Relays

Sept. 20, 2004
The devices in a new series of small-outline IC (SOIC) adapters quickly and cost-effectively upgrade older Aromat HB2E surface-mount TXSS relays while keeping the same pc-board layout. Available on 0.300-in. (7.62-mm) dual-inline package centers, they...

The devices in a new series of small-outline IC (SOIC) adapters quickly and cost-effectively upgrade older Aromat HB2E surface-mount TXSS relays while keeping the same pc-board layout. Available on 0.300-in. (7.62-mm) dual-inline package centers, they can be mounted on pc boards with a hole diameter of 0.028 in. ±0.003 in. (0.71 mm ±0.08 mm). Available with eight leads, the adapters consist of 0.062-in. (1.57-mm) FR-4 with 1 oz. of copper traces on both sides. Pins are 1/2 hard brass alloy, and pin plating is 200-µm minimum tin/lead. The adapters cost $5.40 each in 1000-unit lots and are available from stock.

Aries Electronicswww.arieselec.com(908) 996-6841

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!