Packaging & Interconnects: 5-Gbit/s Cable Assemblies Save PC-Board Space

Nov. 29, 2004
The Triad Differential Pair (TDP) cable assemblies have a shielded dual-row 1.27-mm (0.50-in.) center-line pitch. They also have a cable-to-board interface that offers high speed (50 Gbits/s with 5000-cycle durability) and controlled impedance that...

The Triad Differential Pair (TDP) cable assemblies have a shielded dual-row 1.27-mm (0.50-in.) center-line pitch. They also have a cable-to-board interface that offers high speed (50 Gbits/s with 5000-cycle durability) and controlled impedance that saves pc-board space. Assemblies are available in sizes of 18, 28, 38, 48, and 72 circuits. They have two optional jackscrews (4/40 and M3) for reliable mating retention. Also, they come in up to 24 differential pairs and in standard 1.00-mm (3.28-in.) and 3.00-mm (9.84-in.) lengths. They can be customized to any desired length up to 5.00 mm (16.40 in.). An 18-circuit 1-m cable costs $14.50. Lead time is six weeks.

Molex Inc.www.molex.com; (847) 810-8999, ext.1408

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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