Packaging & Interconnects: Ultra-High Density Interconnects Tackle 15-GHz Applications

Feb. 3, 2005

The UHD interconnect is a cable-to-board and cable-to-cable coax system for ultra-high-density applications with 15-GHz performance. Data rates up to 10 Gbits/s are supported. The interconnects consist of pc-board-mounted interposers/headers and coax cable that can be ganged together in multiposition housings down to 0.120-in. signal-to-signal spacings. Insertion loss is 0.90 dB/ft through 6 GHz using low-loss cables and 0.75 dB/ft using ultra-low-loss cables. The system comes in surface and edge-launch versions with multiple UHD contacts ganged together in a header (1 by 2, 1 by 4, or 1 by 8). Prices start from $14, and availability is within two weeks.

W.L. Gore & Associates Inc.www.gore.com; (800) 445-4673

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.