Pads Fill Gaps Between Heatsinks & Devices

April 1, 1999
This thermally-conductive material is designed to act as a thermal interface between a heatsink and an electronic device. Gap Pad 1500 provides a higher thermal conductivity than standard Gap Pad VO or Gap Pad VO Soft for demanding applications that

This thermally-conductive material is designed to act as a thermal interface between a heatsink and an electronic device. Gap Pad 1500 provides a higher thermal conductivity than standard Gap Pad VO or Gap Pad VO Soft for demanding applications that generate high heat. The conformable Gap Pad 1500 allows the pad to fill air gaps between pc boards and heatsinks or metal chassis. It is a highly conformable, low modulus material that has no fiberglass carrier, and its construction allows flexibility where surfaces are uneven. Thicknesses range from 0.020" to 0.250" with a liner applied to both sides of the material. It is available as die-cut parts or sheets. Continuous use temperature range is -60°C to 200°C.

Company: BERGQUIST COMPANY

Product URL: Click here for more information

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