Conductive Material Plugs Vias

May 1, 1999
For use in high-density interconnect applications, 1210 Silver Conductive Via Plugging Ink is said to provide low-cost blind and buried vias on double-sided and multi-layer pc boards while enhancing reliability. The ink is well-suited for use on

For use in high-density interconnect applications, 1210 Silver Conductive Via Plugging Ink is said to provide low-cost blind and buried vias on double-sided and multi-layer pc boards while enhancing reliability. The ink is well-suited for use on telecommunication, consumer electronic, pager, automotive electronic, personal computer, and other pc boards. The 100% solids ink has virtually no shrinkage on curing and results in boards that are fully planar, more reliable and less expensive to build. The ink is said to eliminate many expensive plating and lamination steps often required for building pc boards and can be used with or without through-hole plating. Self life is 30 days at room temperature.

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