Targeting surface-mount pc board assembly operations, the CR39 solder paste is said to leave a minimal, clear, pale residue after reflow soldering using a wide thermal profile. This lead-free product meets Bellcore and IPC standards for high
Targeting surface-mount pc board assembly operations, the CR39 solder paste is said to leave a minimal, clear, pale residue after reflow soldering using a wide thermal profile. This lead-free product meets Bellcore and IPC standards for high reliability, no-clean pastes and is said to be ideal for rapid printing and reflow soldering in air. The paste is suitable for use in fine-pitch, high-speed stencil printing operations functioning at rates of up to 150 mm/s. The CR39 solder paste is formulated to solder a variety of surfaces, including OSP copper, HASL, gold-over-nickel, and silver immersion. And its high-activity, no-clean flux is suitable for most assembly processes.
