Housed in a multi-chip BGA package, the new WEDPN8M64V-XBX 8M x 64 SDRAM is designed to complement high-performance memory controllers and processors. The low-profile, 25 mm x 25 mm plastic BGA saves a reported 41% board space over an equivalent TSOP solution. It is available in speeds of 100 MHz and 125 MHz.
The memory provides reduced trace lengths and a BT laminate interposer for optimum TCE match. It operates on a single 3.3V power supply and is upgradeable to 16M x 64 in the same bump footprint. It also features internal pipelined operation and is fully synchronous. The chip is suited for telecom, datacom and embedded applications. Pricing starts at $200 each/1,000.
Company: WHITE ELECTRONIC DESIGNS CORP.
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