Claiming to reflow at lower temperatures than standard tin-and-silver alloys, this new lead-free solder paste reflows at 217°C. Designed to meet the needs of printed circuit board assemblers who need an alternative, lead-free alloy with print, tack and reflow characteristics equal to pre-existing lead-free formulations, this paste provides a 24-hour print life and is available in no-clean, low-residue water-soluble, and RMA flux formulations.
Company: EFD INC. - Solder Paste Group
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