Lead-Free Solder Paste Reflows At 217°C

Claiming to reflow at lower temperatures than standard tin-and-silver alloys, this new lead-free solder paste reflows at 217°C. Designed to meet the needs of printed circuit board assemblers who need an alternative, lead-free alloy with print, tack and reflow characteristics equal to pre-existing lead-free formulations, this paste provides a 24-hour print life and is available in no-clean, low-residue water-soluble, and RMA flux formulations.